MANHASSET, NY -- In 3-D IC designs, multiple chips in a package are closely stacked up through connections of TSVs and micro-bumps. These versatile connections allow more functionality
PARIS - Intel researchers are finding ways to improve the monitoring of moisture in PCBs because this variable can be critical to both performance and failure mechanisms.
Interested in high-speed, high quality communications at the chip, board and system level? If so here are ten reasons to come to Santa Clara at the end of January 2013.DesignCon
HOLD HOLD HOLD. DO NOT POST w/OUT A.W. APPROVAL. HOLDING THIS FOR TEST.New Year; new predictions. Each January, EE Times editors go through the list of
LAS VEGAS -- Consumer Electronics Show (CES) keynote speaker Kazuhiro Tsuga, president of Panasonic Corporation, tackled Tuesday morning (Jan. 8) the unenviable challenge on convincing
LAS VEGAS -- As traditional TV manufacturers seek ways to jettison their commodity flat-panel TV businesses, Sharp Corp. is doubling down on its bet to remain viable as a top supplier
SAN JOSE, Calif. - The many flavors of home networks are all claiming advances in technology and adoption at the Consumer Electronics Show, but Wi-Fi clearly remains in the lead with
Read enough about DesignCon on EE Times? Don't cry "uncle" just yet. We've got a collection of mobile and tablet apps to help those of you going to the conference plan your days ...
LONDON - Advanced Micro Devices Inc. said Tuesday (Jan. 8) it has demonstrated working silicon of two quad-core x86 system-chips intended for ultrathin notebooks and convertible ...
Texas Instruments Inc. (TI) debuts the SM28VLT32-HT non-volatile flash memory device for harsh environments. The high-temperature device offers an operational capacity of 4MB and ...
LAS VEGAS - Smart TV is turning out to be a slow learner, through no fault of its own. As evidenced at CES here on Monday (Jan. 7), leading TV makers like LG, Samsung
LONDON - Qualcomm Inc. has announced it is sampling the first two of its next generation of quad-core Snapdragon system chips and that it already has 50 design-wins for them. The