2|15|2013 MANHASSET, NY -- In 3-D IC designs, multiple chips in a package are closely stacked up through connections of TSVs and micro-bumps. These versatile connections allow more functionality
2|15|2013 PARIS - Intel researchers are finding ways to improve the monitoring of moisture in PCBs because this variable can be critical to both performance and failure mechanisms.
2|13|2013 Interested in high-speed, high quality communications at the chip, board and system level? If so here are ten reasons to come to Santa Clara at the end of January 2013.DesignCon
2|7|2013 HOLD HOLD HOLD. DO NOT POST w/OUT A.W. APPROVAL. HOLDING THIS FOR TEST.New Year; new predictions. Each January, EE Times editors go through the list of
1|10|2013 LAS VEGAS -- Consumer Electronics Show (CES) keynote speaker Kazuhiro Tsuga, president of Panasonic Corporation, tackled Tuesday morning (Jan. 8) the unenviable challenge on convincing
1|8|2013 LAS VEGAS -- As traditional TV manufacturers seek ways to jettison their commodity flat-panel TV businesses, Sharp Corp. is doubling down on its bet to remain viable as a top supplier
1|8|2013 SAN JOSE, Calif. - The many flavors of home networks are all claiming advances in technology and adoption at the Consumer Electronics Show, but Wi-Fi clearly remains in the lead with
1|8|2013 Read enough about DesignCon on EE Times? Don't cry "uncle" just yet. We've got a collection of mobile and tablet apps to help those of you going to the conference plan your days ...
1|8|2013 LONDON - Advanced Micro Devices Inc. said Tuesday (Jan. 8) it has demonstrated working silicon of two quad-core x86 system-chips intended for ultrathin notebooks and convertible ...
1|8|2013 Texas Instruments Inc. (TI) debuts the SM28VLT32-HT non-volatile flash memory device for harsh environments. The high-temperature device offers an operational capacity of 4MB and ...
1|8|2013 LAS VEGAS - Smart TV is turning out to be a slow learner, through no fault of its own. As evidenced at CES here on Monday (Jan. 7), leading TV makers like LG, Samsung
1|8|2013 LONDON - Qualcomm Inc. has announced it is sampling the first two of its next generation of quad-core Snapdragon system chips and that it already has 50 design-wins for them. The
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